从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
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"Do it slowly, do it right but let's get on with it," she said. "We have been stagnating at these very low recycling rates for far too long."
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